㈜티에프이의 기술로 이루어낸 TOTAL SOLUTION을 경험해 보십시오.
㈜티에프이의 기술로 이루어낸 TOTAL SOLUTION을 경험해 보십시오.
TEST BOARD
Test Load Board Design
Schematic Design Tool : Or-Cad, Cadance Allegro concept HDL Design Tool : Allegro(PCB Editor, APD) Load BD Design완료 후 Design File에서 Net-List 생성 및 Schematic ECO
(Back-Annotation) 생성된 Net-List 와 Schematic의 Ch List 비교 후 Design Error 검출
SoC Design
Schematic Tool : Or-Cad, Cadance Allegro concept HDL Design Tool : Allegro Layout Library 표준화 (LMS 구축), Part Matching System. EMI / EMC 컨설팅, PI/SI Simulation. High Speed 및 Impedance Matching Rule 적용 Build-Up (0.35Pitch) 설계 , 제작 가능
BURN-IN BOARD
MBT(Monitoring Burn-in Tester)
Burn-in Board
Specifications
Product Category : SDRAM, DDR series, SRAM, GDDR6, RDRAM(DA), NOR/NAND-Flash, MCP
Application System : ANDO8652 Series, DM1400 Series (Test speed Max 20MHz.
Pitch : Min. 0.3 Pitch (Through Hole) ~ All Pitch 대응 가능
Density : Max. 480
PCB Size : 450x570mm
PCB Layer : Max 8L
Normal Burn-In BoardSpecifications
Product Category : SDRAM, DDR series, SRAM, GDDR6, RDRAM(DA), NOR/NAND-Flash, MCP
Application System : ANDO8652 Series, DM1400 Series (Test speed Max 20MHz.
Pitch : Min. 0.3 Pitch (Through Hole) ~ All Pitch 대응 가능
Density : Max. 480
PCB Size : 450x570mm
PCB Layer : Max 8L
THB Test
(Temperature Humidity Bias)
Specifications
Operating condition : 85℃/85%
Target Device : DRAM / SRAM / FLASH / MCP / CIS / DDI / ASIC / PMIC
Type : Socket Direct & Dut board
Pitch : Min. 0.3mm ~ All Pitch 대응 가능
THB Test (Temperature Humidity Bias)Specifications
Operating condition : 85℃/85%
Target Device : DRAM / SRAM / FLASH / MCP / CIS / DDI / ASIC / PMIC
Type : Socket Direct & Dut board
Pitch : Min. 0.3mm ~ All Pitch 대응 가능
MFT(Multi Flexibility Tester)
Burn-in Board
Specifications
Product Category : Flash(NAND, toggle NAND etc.), eMCP
Application System : DM1900 Series (Test speed 100MHz (200Mbps))
Pitch : Min. 0.3 Pitch (Through Hole) ~ All Pitch 대응 가능
PCB Size : 450x555mm
PCB Layer: Max 18L
High-Speed Burn in BoardSpecifications
Product Category : Flash(NAND, toggle NAND etc.), eMCP
Application System : DM1900 Series (Test speed 100MHz (200Mbps))
Pitch : Min. 0.3 Pitch (Through Hole) ~ All Pitch 대응 가능
PCB Size : 450x555mm
PCB Layer: Max 18L
HAST
(High Accelerated Temperature Humidity Test)
Specifications
Operating Condition : 125℃ / 85% / 3G
Target Device : DRAM / SRAM / FLASH / MCP / CIS / DDI / ASIC / PMIC
Type : Socket Direct & Dut board
Pitch : Min. 0.3mm ~ All Pitch 대응 가능
HAST (High Accelerated Temperature Humidity Test)Specifications
Operating Condition : 125℃ / 85% / 3G
Target Device : DRAM / SRAM / FLASH / MCP / CIS / DDI / ASIC / PMIC
Type : Socket Direct & Dut board
Pitch : Min. 0.3mm ~ All Pitch 대응 가능
Burn-in Board Design
Schematic Tool : Cadstar Schematic, Or-Cad, Cadance concept HDL Design Tool : Allegro Layout, Power PCB, Cadstar
Product
Normal Burn-In Board
High Speed Burn-In Board
THB (Temperature Humidity Bias) Test
HAST (High Accelerated Temperature Humidity Test)